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A micro cooling unit designed to simulate the various working temperature conditions on the electronic chip board.
Stated Power Cooling Capabilities:
Specimen dimensions: Variable from W 35MM X D 35MM to 60 x 60mm Cooling head dimensions: Interchangeable according to dimensions.Number of specimens: 1 Numbers tested at a time.
|Temperature Accuracy||<2.0º C|
|Typical Transition Rates||25ºC to 0ºC in, <2-3 minutes|
|Temperature Sensor||T-type Thermocouple|
|DB Rating||63-65 d BA|
|Electrical/230/240 VAC ±10%||50/60 Hz, single phase, 12A Max.|
|Ambient Temperature||5ºC to 25 ºC (40 to 77ºF)|
|Ambient Humidity||20% to 95% RH|
|System Dimensions:||L800mm x W 600 mm x H 750mm Approx.|
|System Weight:||100-120 KG|
|Thermal Head (mm):||40mm|
|Thermal Head Hose:||2.5 - 3.0 meter.|
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