
A micro cooling unit designed to simulate the various working temperature conditions on the electronic chip board.
Stated Power Cooling Capabilities:
Specimen dimensions: Variable from W 35MM X D 35MM to 60 x 60mm Cooling head dimensions: Interchangeable according to dimensions.Number of specimens: 1 Numbers tested at a time.
Maximum Temperature | +40ºC |
Minimum Temperature | -40ºC |
Temperature Accuracy | < 2.0º C |
Typical Transition Rates | 25ºC to 0ºC in, < 2-3 minutes |
Temperature Sensor | T-type Thermocouple |
DB Rating | 63-65 d BA |
Electrical/230/240 VAC ±10% | 50/60 Hz, single phase, 12A Max. |
Ambient Temperature | 5ºC to 25 ºC (40 to 77ºF) |
Ambient Humidity | 20% to 95% RH |
Mechanical Dimensions | |
System Dimensions: | L800mm x W 600 mm x H 750mm Approx. |
System Weight: | 100-120 KG |
Thermal Head (mm): | 40mm |
Thermal Head Hose: | 2.5 - 3.0 meter. |
Varieties of